低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
分别采用三种不同的技术对多芯片组件互连延迟进行建模，并给出了相应的解。
Interconnection delay in MCM 's is modeled by using three different techniques, and the associated formulas are also derived.
多芯片组件是实现电子装备小型化、轻量化、高性能、低成本专用集成电路不可缺少的关键技术。
MCM is the necessary technique to realize the equipment smaller, lighter, more excellent performance and lower cost.
多芯片组件是实现电子装备小型化、轻量化、高性能、低成本专用集成电路不可缺少的关键技术。
MCM is the necessary technique to realize the equipment smaller, lighter, more excellent performance and lower cost.
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