从硅材料的物理性能出发，分析其微细电火花加工的可行性。
This paper analyses the micro EDM feasibility for semiconductor silicon from the physical properties of silicon.
本文对电子束加工微细弯孔的有关问题进行了研究，导出了相关的物理方程，为微细弯孔的加工提供了理论依据。
This paper studied the problems in machining tiny curved holes with electron beam. The concerned formulae were derived so as to provide the basis for machining of tiny cured holes.
本文对电子束加工微细弯孔的有关问题进行了研究，导出了相关的物理方程，为微细弯孔的加工提供了理论依据。
This paper studied the problems in machining tiny curved holes with electron beam. The concerned formulae were derived so as to provide the basis for machining of tiny cured holes.
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