低粘度，室温固化胺类固化剂，特别用于浇铸模具的制作。
Low viscosity, a room temperature curing amine hardener. Specially formulated filler is recommended for casting of patterns and moulds.
研究了DCPD酚环氧树脂与酸酐及胺类固化剂的固化反应活性。
It was studied on the curing activity of DCPD phenol epoxy resin with anhydrides and amines.
低粘度浇铸树脂，建议与胺类和聚肽胺类固化剂组合用于低压电器。
Low viscosity reactive casting resin. Recommended with amine and polyaminoamide curing agents for low voltage electrical and electronic applications.
低粘度弹力浇铸树脂，建议与先加入的硅微粉和胺类固化剂合用，用于低压电缆的连接。
Low viscosity resilient casting resin. Recommended for pre-filled silica formulations with low caking tendency used with amine curing system for low voltage cable joints.
阻燃型胺类环氧树脂固化剂主要包括含磷、舍氮杂环、含硅胺类固化剂，以及舍氮磷杂环和含硅一磷胺类固化剂。
The flame retarded curing agents' mainly included phosphorus-containing, nitrogen - containing, silicon-containing, phosphorus-nitrogen and silicon-phosphorus amines curing agents.
解决了低分子胺类环氧固化剂无法在水中、低温环境中交联固化的问题。
Problems like difficulty for epoxy firming agent of low-molecular amine to be inter-connected and firmed in water or at lower temperatures have been solved.
解决了低分子胺类环氧固化剂无法在水中、低温环境中交联固化的问题。
Problems like difficulty for epoxy firming agent of low-molecular amine to be inter-connected and firmed in water or at lower temperatures have been solved.
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