During fabrication of the NEMS probes, KOH anisotropic etching technology has been developed for the formation of suitable silicon island with top size within 0.5 to 0.8m.
在器件制造的过程中，采用KOH各向异性腐蚀硅尖技术制造出了顶部尺寸在0.5～0.8微米范围内符合要求的硅岛；
Some new techniques are adopted, for example, technology of dual-face alignmental silicon etching and anisotropic corrosion (micromachine), etc.
采用双面对准光刻工艺，各向异性腐蚀微机械加工制硅膜片等新技术。
Some new techniques are adopted, for example, technology of dual-face alignmental silicon etching and anisotropic corrosion (micromachine), etc.
采用双面对准光刻工艺，各向异性腐蚀微机械加工制硅膜片等新技术。
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