To avoid heading into the twilight zone of extreme ultraviolet lithography (or, worse, X-rays), chipmakers need to shrink the light.

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Under the Co-Investment Program, which was announced on July 9, 2012, ASML will accelerate the development of key lithography technologies needed to extend Moore's Law, notably Extreme Ultraviolet (EUV) lithography.

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The specific technology areas that Intel is investing in are 450mm wafers and extreme ultraviolet (EUV) lithography.

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