综述了制备uls I低介电常数材料的各种CVD技术。
Various CVD technologies for preparing low dielectric constant materials in ULSI circuits are summarized.
本文介绍了有关低介电常数材料薄膜的制备方法和基本特性的检测技术。
In this paper, we introduced the technologies used in preparation and test of low-dielectric-constant materials.
对目前已研究和使用过的低介电常数和低烧结温度基板材料及综合性能，流延浆料有机添加剂进行了对比分析。
The low sintering and low dielectrics substrate materials and their properties, and the organic additives for tape casting slurry are compared and analyzed.
将电磁带隙材料用于孔径耦合微带天线的设计，利用其频率带隙抑制天线中激励的表面波，分别考虑高介电常数和低介电常数的情况。
The electromagnetic band-gap (EBG) materials is used to design the aperture coupled patch antennas, and both high permittivity and low permittivity materials are considered in this paper.
新开发的低损耗、低介电常数的低温共烧陶瓷(LTCC)材料最适合做微波mcm的基板材料。
The newly developed low loss, low dielectric constant and low temperature co fired ceramics (LTCC) materials are the best substrate for microwave MCM technology.
与无机材料相比，聚全物材料具有较大的电光响应、高的破坏阚值和低的介电常数，并且容易加工成形。
Compared to inorganic materials, polymeric materials have larger electro-optical response, lower dielectric constant, and higher damage threshold, and are easier to be processed.
与无机材料相比，聚全物材料具有较大的电光响应、高的破坏阚值和低的介电常数，并且容易加工成形。
Compared to inorganic materials, polymeric materials have larger electro-optical response, lower dielectric constant, and higher damage threshold, and are easier to be processed.
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