低导热率和低热容。
耐高温、低热容。
结论指出，半导体致冷只适用于低热容量系统或高压密封系统。扩大应用范围的唯一途径是研究新型高优质系数的常温致冷材料。
The conclusion shows that semiconductor cooling effect can only be applied in low heat capacity system or in high pressure closed system.
为了降低热导和热容，提高探测器的探测灵敏度，用KOH作化学腐蚀完全去除了线性阵列下方的硅衬底，形成悬空结构。
In order to reduce the thermal conductivity and heating capacity and increase the detectivity of array, the suspended structure was formed on silicon wafer by chemical etching of KOH.
为了降低热导和热容，提高探测器的探测灵敏度，用KOH作化学腐蚀完全去除了线性阵列下方的硅衬底，形成悬空结构。
In order to reduce the thermal conductivity and heating capacity and increase the detectivity of array, the suspended structure was formed on silicon wafer by chemical etching of KOH.
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