The drying device solves the problems in the prior art that the wafers have residual moisture on the surfaces after drying and need long drying time, so as to improve the wafer drying efficiency.
本发明干燥装置由于解决了现有技术晶圆干燥后表面残留水份并且干燥时间长的问题，因而提高了晶圆干燥的效率。
The drying device solves the problems in the prior art that the wafers have residual moisture on the surfaces after drying and need long drying time, so as to improve the wafer drying efficiency.
本发明干燥装置由于解决了现有技术晶圆干燥后表面残留水份并且干燥时间长的问题，因而提高了晶圆干燥的效率。
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