The results showed that the as-deposited films were amorphous TiO2 film.
分析结果表明，室温下沉积得到的薄膜为非晶态。
The as-deposited film shows a dielectric constant as low as 2.0 and has high transparency in the visible light range.
沉积的薄膜介电常数约为2.0，在可见光区薄膜具有良好的透光性。
In this paper, WO3 thin film was deposited on glass substrate and silicon slice by DC reactive magnetron sputtering and using metal tungsten as target.
本文采用直流反应磁控溅射工艺，以金属钨为靶材，在玻璃和单晶硅片上沉积了WO 3薄膜。
By the technology of vacuum cathodic arc deposition, graphite as cathode, Diamond like carbon film (DLC) was deposited on PMMA resin denture.
采用电弧离子镀膜方法，以高纯石墨为碳离子源在PM MA树脂义齿表面沉积类金刚石膜。
Devices deposited on flexible substrates have some advantages such as weight-light, flexibility, etc. Therefore, flexible transparent conductive film has become a focus of research.
在柔性衬底上制作的器件具有重量轻、柔软等优点，所以柔性透明导电薄膜成为当前的研究热点。
Annealed film structure is looser than as-deposited one.
退火态的膜层结构比沉积态的疏松。
Metallic antimony thin film was deposited by magnetron sputtering and it was investigated as anode materials for lithium-ion batteries.
采用磁控溅射方法制备金属锑薄膜，并把它作为锂离子二次电池负极进行研究。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
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