The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The paper studied the reaction mechanism of self bonding in dry process binderless fiberboard manufacture by investigating the chemical composition and conversion of wood.
通过干法无胶纤维板制造过程中对木材化学成分的转化和含量变化的研究，探讨了干法无胶纤维板的粘合机理。
The paper studied the reaction mechanism of self bonding in dry process binderless fiberboard manufacture by investigating the chemical composition and conversion of wood.
通过干法无胶纤维板制造过程中对木材化学成分的转化和含量变化的研究，探讨了干法无胶纤维板的粘合机理。
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