In this paper, the conditions of composite chemical copper plating with two solid particles ZnO and SnO are studied.
研究了氧化锌、氧化亚锡两种固体微粒复合化学镀铜的工艺条件。
Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.
探讨了利用原化学镀铜废液中的甲醛将铜还原，后酸化回收EDTA的新工艺。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
The invention also provides a manufacturing method for copper-based antifriction compound powder which comprises: A. the step of preparing chemical copper plating coating graphite powder;
本发明还提供一种铜 基减摩复合粉末的制造方法，包括：A。制备化学镀铜包覆石墨粉步骤；
A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.
研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。
The effect of rare earths on the chemical pre-plating process for electro-deposition of foamy copper was studied through experiments.
通过实验手段，研究了稀土对电沉积法制备泡沫铜化学预镀工艺的影响。
Several preparation techniques of basic cloths used for scattering anti-radar camouflage net were compared, among which chemical copper-plating was found to be the most suitable one.
对几种散射型防雷达伪装网装饰片基础布的制备工艺进行了比较，选取了织物化学镀铜为其制备工艺。
The results of the experiment indicate that: (1) The combining strength is higher in the chemical plating copper on the ceramics;
结果表明：（1 ）陶瓷化学镀铜结合强度较高，化学镀设备简单，成本低廉；
And in this article, various process parameters such as electrolysis alkali wash, pickling and chemical displacement copper plating, testing equipment type and anneal process are given.
文中给出了电解碱洗、酸洗及置换镀铜时各种工艺参数及所用试验设备型号及拉拔退火工艺。
The reaction of chemical replacement copper plating on iron surface and profile of the coating have been investigated by electrochemical methods and scan electron microscopy.
用电化学方法和扫描电子显微镜研究了钢铁置换镀铜反应及镀层形貌，结果表明：钢铁表面的置换铜镀层总是多孔的。
The reaction of chemical replacement copper plating on iron surface and profile of the coating have been investigated by electrochemical methods and scan electron microscopy.
用电化学方法和扫描电子显微镜研究了钢铁置换镀铜反应及镀层形貌，结果表明：钢铁表面的置换铜镀层总是多孔的。
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