Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
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