The weight of copper plating solution in a unit volume was function of contents of cupric pyrophosphate and potassium pyrophosphate.
镀液单位体积的重量是焦磷酸钾和焦磷酸铜含量的函数。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with 1286 electrochemical interface and rotating disc electrode.
采用1286电化学接口及旋转圆盘电极测定了硫酸铜镀液阴极极化曲线和循环伏安曲线。
Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.
因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高碱性无电镀铜溶液。
The component data of pearl nickel, bright nickel, acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained.
为了获得电镀的最佳结果，在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
The effects of C2N2H8 on the properties of copper brush plating solution and copper deposits are investigated in the present paper.
主要就乙二胺在电刷镀铜溶液中的作用及其对镀铜层性能的影响进行了试验研究。
Several solution composition for cleaning, zinc dipping and subsequent copper, nickel, chromium plating are given.
文章中给出了若干清洗、浸镀锌以及后来镀铜、镍、铬加工液的配方。
Several solution composition for cleaning, zinc dipping and subsequent copper, nickel, chromium plating are given.
文章中给出了若干清洗、浸镀锌以及后来镀铜、镍、铬加工液的配方。
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