Diamond film wafers with different thickness were prepared by high power DC arc plasma jet CVD method.

采用高功率直流电弧等离子体cvd工艺制备了不同厚度的无裂纹自支撑金刚石厚膜。

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Diamond film wafers with different thickness were prepared by high power DC arc plasma jet CVD method.

采用高功率直流电弧等离子体cvd工艺制备了不同厚度的无裂纹自支撑金刚石厚膜。

youdao