The destructive physical analysis (DPA) is used to detect the semiconductor devices.
分析(DPA)是用于检测半导体器件的。
It is a crucial step for destructive physical analysis (DPA) and failure analysis (fa) to remove the plastic package for the die exposing.
去除塑料包封层，露出芯片表面，是DPA(破坏性物理分析)及FA(失效分析)的关键一步。
It is a crucial step for destructive physical analysis (DPA) and failure analysis (fa) to remove the plastic package for the die exposing.
去除塑料包封层，露出芯片表面，是DPA(破坏性物理分析)及FA(失效分析)的关键一步。
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