A flexible tape substrate for a semiconductor die to be mounted on an area thereof has a two-dimensional array of apertures formed therein around at least one side of the area.
柔韧带基片，用于将被安装于它的一个区域的半导体晶片，具有形成于其中的孔的二维阵列，该阵列环绕区域的至少一边。
A flexible tape substrate for a semiconductor die to be mounted on an area thereof has a two-dimensional array of apertures formed therein around at least one side of the area.
柔韧带基片，用于将被安装于它的一个区域的半导体晶片，具有形成于其中的孔的二维阵列，该阵列环绕区域的至少一边。
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