Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
The research keystones of copper electroless plating were presented.
提出了化学镀铜今后的研究重点。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.
在化学镀镍-磷合金液中加入硫酸铜制得镍-铜-磷三元合金。
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
Interfacial strength would be increased between carbon nanotubes and metal-matrix through electroless plating a continuous layer of copper on carbon nanotubes.
通过化学镀在碳纳米管表面镀上一层连续的铜镀层，以改善碳纳米管与金属基体的润湿性，增强界面结合力。
The disadvantages of common electroless copper plating process were pointed out.
指出了普通镀铜工艺的缺点。
The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.
提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
应用推荐