Some pores appeared mainly near in the bond line, but porosity can be suppressed to a great extent by increasing welding speed or electron beam scanning.
结果表明，在保证试件完全焊透的情况下，降低电子束的线能量，可在一定程度上提高接头的强度；
Some pores appeared mainly near in the bond line, but porosity can be suppressed to a great extent by increasing welding speed or electron beam scanning.
结果表明，在保证试件完全焊透的情况下，降低电子束的线能量，可在一定程度上提高接头的强度；
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