The research on element interdiffusion, reaction and microstructure at the interface of solder joints is vital to the study of lead free solder joints reliability.
因此钎焊过程和服役过程中界面的反应、扩散以及界面的微观组织对当前无铝钎料可靠性研究具有重大意义。
The results show that there is an interlayer, which is developed at the interface due to the interdiffusion of aluminium element and enamel elements .
结果表明，密着性能优良的无铅建筑铝搪瓷界面存在铝元素与瓷釉元素相互扩散的中间过渡层；
The results show that there is an interlayer, which is developed at the interface due to the interdiffusion of aluminium element and enamel elements . The cohesion between aluminium and the interla…
结果表明，密着性能优良的无铅建筑铝搪瓷界面存在铝元素与瓷釉元素相互扩散的中间过渡层；
The results show that there is an interlayer, which is developed at the interface due to the interdiffusion of aluminium element and enamel elements . The cohesion between aluminium and the interla…
结果表明，密着性能优良的无铅建筑铝搪瓷界面存在铝元素与瓷釉元素相互扩散的中间过渡层；
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