The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
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