Moreover, the epoxy adhesive with high intensity, high toughness and high fill factor is made by molecule design and chemical production technology.
同时，采用分子设计与化学制备技术制备环氧胶粘剂，具有高强高韧高填充比等特点；
The prepared CMOS image sensor meets the requirement for technological parameters of devices, has high fill factor and effectively improves the image quality of the CMOS image sensor.
本发明制备得到的CMOS图像传感器满足器件工艺参数并且填充因子高，有效地提高CMOS图像传感器的图像质量。
The prepared CMOS image sensor meets the requirement for technological parameters of devices, has high fill factor and effectively improves the image quality of the CMOS image sensor.
本发明制备得到的CMOS图像传感器满足器件工艺参数并且填充因子高，有效地提高CMOS图像传感器的图像质量。
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