High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Several types of high density packaging and their application prospects are emphatically described.
重点介绍了高密度封装形式及应用前景。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
Discussions are made about the modeling and analysis of various structural components in high density packaging. Relative programs have been tailored to suit these methods.
本文对高密度封装中各结构成分的模型建立及分析作了讨论，根据这些方法编制了相应的程序。
High Density Electronic Packaging?
高密度电子封装 HDEP?。
High Density Electronic Packaging?
高密度电子封装 HDEP?。
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