Rare earth improved electroless plating method was developed for simultaneously depositing Pd-Ag alloy film on ceramic support.
采用稀土改进的化学镀法在多孔陶瓷载体上共沉积钯-银合金膜。
A self-limiting electroless plating process is provided to plate thin films with improved uniformity.
本发明提供一种自限制化学镀方法，以镀具有改进的均匀性的膜。
Compared with conventional electroless nickel plating process, the deposits obtained are greatly improved with higher phosphorus content, hardness, more compact and uniform microstructure.
与传统化学镀镍工艺相比，该工艺所得镀层含磷量高、硬度高，组织结构致密均匀。
Compared with conventional electroless nickel plating process, the deposits obtained are greatly improved with higher phosphorus content, hardness, more compact and uniform microstructure.
与传统化学镀镍工艺相比，该工艺所得镀层含磷量高、硬度高，组织结构致密均匀。
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