The development of the better technique to characterize the bond strength of film-substrate interfacial is a hot topic that is concerned at large by film researchers.
开发新的膜—基界面结合强度定量检测技术是目前薄膜技术科研人员普遍关注的热点问题。
The development of the better technique to characterize the bond strength of film-substrate interfacial is a hot topic that is concerned at large by film researchers.
开发新的膜—基界面结合强度定量检测技术是目前薄膜技术科研人员普遍关注的热点问题。
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