Multilayer ceramic chip capacitors (MLCC) to meet the X7R?
多层陶瓷片式电容器(MLCC)满足X7R ？
Tantalum Capacitor. 2. Multilayer Ceramic Capacitors 3. Network Capacitor. 4. Network Resistor.
钽电容器；2、独石电容器；3、网络电阻；4、网络电容器。
The package is a multilayer ceramic structure and has the electrical interconnection with logical function.
该封装为多层陶瓷结构，并具有电连接逻辑关系。
Multilayer ceramic capacitors (MLCC) is one of the main products of the new surface mounted components (SMC).
片式多层陶瓷电容器是新型片式元器件门类的主要品种之一。
The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
KEMET Corporation is a worldwide famous manufacturer of solid tantalum capacitors, multilayer ceramic capacitor and solid aluminum capacitor.
KEMET公司是世界上著名的固体钽电容、多层陶瓷电容和铝电容器制造商。
The invention provides a multilayer ceramic substrate which is stacked by multiple glass ceramic layers and provided with the internal conductor.
本发明提供了由多个玻璃陶瓷层叠层并具有内部导体的多层陶瓷衬底。
The scanning laser acoustic microscope is a new type of nondestructive testing technique for detecting the internal defects of multilayer ceramic capacitors.
激光扫描声学显微镜是一种新型的无损检测多层陶瓷电容器内部缺陷的测量技术。
Multilayer ceramic capacitors such as high reliability types for automobiles, small types for mobile communications devices and high voltage types for power suppliers.
用于汽车、小型移动通信设备和高压电源的高可靠性积层陶瓷电容器。
Recent development trends of multilayer ceramic capacitors are miniaturisation, lower voltage, larger capacitance, lower production cost and formation of HV MLCC series.
小型、低压、大容量化，片式高压系列化和低成本化是当前多层陶瓷电容器的主要技术发展趋势；
Small size, low weigh and high working frequency are the characteristics of multilayer ceramic microwave filter, and it is now being employed in communication and electric products application.
多层陶瓷微波滤波器是一种基于低温陶瓷共烧技术的新型滤波器，具有小型化、轻便化和高频化特点，在通信、汽车、数字化家电等产品中已得到广泛应用。
At the conference and exhibition, the company will be highlighting its latest industry-leading multilayer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products.
在会议和展览，公司将着重突出了其最新的业界领先的多层陶瓷片式电容器(MLCC)及表面贴装和线粘合薄膜产品。
Such a multilayer unit for multilayer ceramic electronic components is produced by printing a conductive paste on a ceramic green sheet in a certain pattern, thereby forming an electrode layer.
用于多层陶瓷电子元件的多层单元是通过按照一定图案将导电糊印刷在陶瓷生片上形成电极层来生产的。
Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
The ceramic material is suitable for fabricating multilayer microwave chip devices.
该材料可用于制造片式多层微波器件。
The multilayer toughening conch nacre structure bio-inspired ballistic resistant composites which consisted of thin layer ceramic and resin matrix composites were prepared.
将薄层抗弹陶瓷材料与树脂基复合材料通过仿生结构设计制备了软、硬相交替叠合的多层增韧贝壳珍珠层结构仿生复合材料。
The silver diffusion mechanism in low temperature cofired microwave dielectric ceramic components fabricated by using multilayer technology was studied.
研究了叠层共烧工艺制备的微波介质陶瓷器件的银扩散机制。
The recent achievements on the research of the multilayer chip ceramic devices are reviewed in this paper.
综述近几年来文献报导的关于叠层片式陶瓷电子元件的研究现状。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
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