Dishing problem of copper multilayer interconnection in ULSI was introduced, and the reasons and influencing factors were analyzed.
介绍了UL SI多层铜互连线中的碟形坑问题，对其产生的原因及影响因素进行了分析。
Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same.
金属还原方法，多层互连结构及制法，半导体器件及制法。
Finally the relationship between high - order interconnection and multilayer network architecture is discussed.
本文最后讨论了高阶连接和多层网络结构的关系。
The package is a multilayer ceramic structure and has the electrical interconnection with logical function.
该封装为多层陶瓷结构，并具有电连接逻辑关系。
The package is a multilayer ceramic structure and has the electrical interconnection with logical function.
该封装为多层陶瓷结构，并具有电连接逻辑关系。
应用推荐