Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board.
用于挠性印刷线路板的具有基材的粘合片，其制造方法，多层挠性印刷线路板和挠性-刚性印刷线路板。
Today, all developments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.
今天，凡是在刚性多层板的技术进步，同样，在刚-挠性印制板也是能够实现的。
Today, all developments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.
今天，凡是在刚性多层板的技术进步，同样，在刚-挠性印制板也是能够实现的。
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