Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.

研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。

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Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.

研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。

youdao