Shockproof packaging can be compared with the cutting, forming; due to greater difference in density can also have a wider range of uses.
相对于防震包装可以切割、成型；因密度差异较大，还可以有更为广泛的用途。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
The relations between process and product characteristic of straw packaging material and the influence of density of straw packaging material on its performance were studied.
研究了麦秸防护内衬包装材料的工艺和产品特性之间的关系，以及密度对这种材料性能的影响。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
We will use your product's shape, weight and packaging test requirements, the design of different density foam material, and use the best packaging solutions to reduce packaging costs.
不会的。我们会根据您产品的形状、重量以及包装测试要求，设计不同密度的发泡原料，并采用最佳的包装方案来降低包装成本。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Discussions are made about the modeling and analysis of various structural components in high density packaging. Relative programs have been tailored to suit these methods.
本文对高密度封装中各结构成分的模型建立及分析作了讨论，根据这些方法编制了相应的程序。
Several types of high density packaging and their application prospects are emphatically described.
重点介绍了高密度封装形式及应用前景。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging.
所述结构可具有较不复杂的聚焦、减小的串扰、较紧密的像素组装密度、提高的量子效率及晶 片级封装。
High Density Electronic Packaging?
高密度电子封装 HDEP?。
High Density Electronic Packaging?
高密度电子封装 HDEP?。
应用推荐