This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
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