This paper describes the reliability evaluation and analysis technology of Pb-free solder mounting components, to meet customer's need of electronics and automobile industries scale.
概述了无铅焊料安装元件的可靠性评价和解析技术，以满足电子和汽车工业领域的顾客需要。
Finally the life of CSP solder joint based on Pb-free material 95.
基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。
Finally the life of CSP solder joint based on Pb-free material 95.
基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。
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