The composition, the molecular and the characteristics of polyimide (PI) fiber as a precursor of carbon fibers were introduced.
介绍了作为碳纤维前驱体的聚酰亚胺（PI）纤维的组成、分子结构和特性；
Membrane material USES polyimide, the model of module USES hollow fiber, the process of practicing USES pressure process.
膜材料选用了聚酰亚胺，膜组件类型选用了中空纤维，膜过程操作方式选用了加压式。
Traditionally, this insulator is made of epoxy, epoxy filled glass fiber, polyimide, or other dielectric materials.
一般上，绝缘介质是由环氧树脂。环氧填充玻璃纤维。聚酰亚胺，或其他介质材料制成。
Glass fiber or polyethylene naphthalate (PEN) or polyimide film is adopted to strengthen the penetration resistance and the tear resistance in the process of application.
为了增强其应用过程中抗穿透、撕裂的能力，采用玻璃纤维或聚萘二酸乙二 醇酯或聚酰亚胺薄膜增强。
The polyimide resin is suitable for steeping carbon fiber, fiber glass or aramid fiber and the like to be prepared into prepreg;
所述的聚酰亚胺树脂适于浸渍碳纤 维、玻璃纤维或芳纶纤维等，制成预浸料；
The polyimide resin is suitable for steeping carbon fiber, fiber glass or aramid fiber and the like to be prepared into prepreg;
所述的聚酰亚胺树脂适于浸渍碳纤 维、玻璃纤维或芳纶纤维等，制成预浸料；
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