Using the continuous sending laser light source and semiconductor photoelectric position sensitive device, a high accurate tri-dimensional non-contact optical measurement system is designed.
利用连续发射的激光光源和半导体光电位置敏感器件，设计了一种三维非接触高精度的光学测量系统。
An intelligent coated plate thickness measurement system based on a semiconductor laser diode as light source and a CMOS image sensor is introduced.
介绍了一种以半导体激光器为光源，以新型CMOS面阵图象转换器件为传感器的智能型覆铜板测厚系统。
On the above basis, a dimension measuring system that USES semiconductor laser as its light source and PSD as the receiver, is proposed. Its precision is verified by experiments.
在此基础上，提出了一种采用半导体激光器作光源，PS D作光电接收器的尺寸测量系统，并通过实验对其精度进行了验证。
The second system is tunable laser light source based on semiconductor optical amplifier(SOA), light output power and signal-to-noise ratio are improved effectively;
第二套系统采用的是基于半导体光放大器（SOA）的可调谐激光器做光源，有效的增加了光源的输出功率，提高了信噪比；
The device comprises a semiconductor laser light source, an optical beam shaping system, an optical beam transmission system, an optical beam scanning system, an optical focusing system, and the like.
该装置包括半导体激光光源、光束整形系统、光束传输系统、光束扫描系统、光学聚焦系统等。
The device comprises a semiconductor laser light source, an optical beam shaping system, an optical beam transmission system, an optical beam scanning system, an optical focusing system, and the like.
该装置包括半导体激光光源、光束整形系统、光束传输系统、光束扫描系统、光学聚焦系统等。
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