YMS-50 Laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer.
YMS - 50激光切割机是专用于太阳能硅片电池切割的设备。
This market research report covers the 2008 silicon wafer reclaim for the semiconductor market and provides a forecast to 2011.
该市场调研报告涵盖了2008年半导体市场的硅片回收状况以及对于2011年的预测。
The micro machinery commonly is formed by a semiconductor substrate such as a silicon wafer.
微机械一般使用半导体衬底比如硅晶片形成。
The micro machinery commonly is formed by a semiconductor substrate such as a silicon wafer.
微机械一般使用半导体衬底比如硅晶片形成。
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