A small slice of a semiconductor, usually silicon, that contains miniaturized electronic circuit.
一种很小的片状半导体材料，通常是硅材料，它含有小型化。
Die: a single piece of semiconductor material that has been cut from a slice by scribing and breaking.
硅晶圆大圆片上切割而成的一个小片半导体材料。
Die: a single piece of semiconductor material that has been cut from a slice by scribing and breaking.
硅晶圆大圆片上切割而成的一个小片半导体材料。
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