The relationship between the surface's unit resistance of the film with contents of silver plated copper powder and its particle size, and the contents of coupling agent were studied.
分别研究了漆膜表面单位电阻与镀银铜粉的含量及其粒径以及钛酸酯偶联剂的含量之间的关系。
The preparation process flow of conducting paint and silver plated flake copper powder as conducting filling were introduced.
介绍了导电漆、作为导电填料的片状镀银铜粉的制备工艺流程。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
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