Silver-copper powder was prepared by plating silver on micron sized copper powder, its properties were examined, and the test results obtained were then analyzed in this discussion.
采用化学沉积法在微米级铜粉上镀银，并对得到的镀银铜粉的性能进行测试，对得到的结果进行了分析。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
应用推荐