Equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
Use only with production equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
介绍焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.
本文简述了锡膏印刷的工艺流程，分析印刷过程中造成的相关缺陷及其产生的原因，并提出了相应的解决方法。
Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.
焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
A solder paste used for brazing was developed and its technical performance was investigated.
研制了铝硬钎焊用钎料膏，对其工艺性能进行了研究。
It specifies the influence of the parameters of solder paste printing, printing cycle, ease operation of software and additional steps of cleaning and inspection on improving the quality of products.
阐述了锡膏印刷工艺参数，印刷周期，操作软件的易用性，以及清洗、检验等附加工序对实际生产量的影响。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
Of greater value to the stencil designer is the area ratio, which can be related directly to eventual solder paste release.
对于钢网设计者来说非常重要的是面积比率。它直接与锡膏释放有关。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
讨论了电子产品s MT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
概述了低熔点和高熔点型无铅焊膏的开发动向。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
X-RAY-ray inspection using a lead-free solder paste of voids issue, found that the size and diameter welded hollow in acceptable range.
使用X-RAY射线检测了无铅锡膏的焊接空洞问题，发现焊接空洞的大小和直径都在可以接受范围内。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
This product is no-clean solder paste, very little residue, no cleaning.
本产品是免清洗焊膏，几乎无残留，无需清洗。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
Do not use the other metal components contact solder paste.
勿使用其它金属成份接触锡膏。
These examples illustrate that to perform an effective solder paste inspection, the inspection system must be able to provide not only area but also accurate volume and height information.
这些例子说明，要进行有效的焊膏检测，检测系统必须不仅能提供印刷焊膏的面积信息，还应能提供其精确的体积和高度信息。
The factors affecting soldering ability of rosin-based flux for lead-free solder paste, and the factors affecting erosion resistance are discussed.
实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
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