Finally the life of CSP solder joint based on Pb-free material 95.
基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。
Ball Valves Threaded, Socket-Welding, Solder Joint, Grooved and Flared Ends.
球阀线程，插焊，焊点，槽和扩口端。
Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。
Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution;
热疲劳；随机变量；概率分析；焊点；对数正态分布；
And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .
分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.
焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.
主要研究了不同氧含量对QF P引脚焊点拉伸强度的影响，得到一个最佳的氧含量范围。
The 3-d evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理和焊点形态理论，建立了LCCC器件焊点三维形态预测模型。
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
The experiment results show that there is linear relationship between the solder joint creep damage and its resistance changes.
研究表明，焊点的蠕变损伤与其电阻变化存在着线性关系。
The software which was adopt to come true based on image processing used for solder joint image processing and quality judgement.
软件用于焊点图像的处理及质量判定，采用基于图像处理技术实现。
Furthermore, the formation of cracks results in the degradation of solder joint strength, but affects mildly to the electrical properties.
裂纹的产生导致了两种焊点强度的降低，对其电性能的影响却甚微。
The board defect of the circuit measuring includes two parts: the solder joint defect measuring and measuring of the components and parts.
电路板缺陷检测包括两部分：焊点缺陷检测和元器件检测。
Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
研究现状表明快速冷却有助于减少焊接缺陷，提高焊点可靠性。
In the modern automotive industry, extensive use of spot-welding in the body, the solder joint failure is the main reason leading to vehicle failure.
在现代汽车工业中，点焊广泛运用在车身中，焊点失效是导致车身失效的主要原因。
The prediction of fatigue life, especially high-cycling fatigue life, of a solder joint is one of the most difficult problems in electronic industry.
最后，提出了简便预测这类结构的高周疲劳寿命方法，且预测结果与试验结果吻合较好。
Small solid solder joint, electrical conductivity, and no signal attenuation, when subjected to high temperature and low temperature will not fall off.
焊点细小牢靠、导电性好、无讯号衰减，在经受高温和低温时不会脱落。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.
该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。
The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;
研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；
The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;
研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；
应用推荐