By adopting the Surface Mount Technology (SMT), the circuit is compact structured in a reasonably arranged layout.
电路采用贴片技术，结构紧凑、布局合理。
In the early 1990s Universal developed a modular platform concept and shipped its first platform-based surface mount technology machines in 1993.
90年代初，公司开发出组合平台概念，于1993年首次运交平台支持平面安装技术机器。
A fast three-step path planning algorithm was proposed for automatic optic system to inspect electronic product defects by using surface mount technology.
针对检测表面贴片产品缺陷的光学检测系统，提出一种三阶段的快速路径规划算法。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Surface Mount technology is extensively applied in the assembly of electronic components and PCBs. The article illustrates some of the concerns in SMT processing technology on PCB designs.
表面安装技术在许多电子产品的生产制造中已被大量采用，本文就表面安装PC B设计时需考虑的一些制造工艺性问题进行了阐述。
GLENN ELECTRONICS DEVICES CO. , LTD founded in 1993, is a leading Professional manufactory specialized in designing. producing and distributing equipments and devices of Surface Mount Technology.
格林电子设备有限公司，成立于1993年，是一家集规划、设计、研制、生产和销售整厂自动化设备于一体的专业公司。
A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
Standard surface-mount technology or through-hole techniques provide adequate performance.
标准表面贴装技术或通孔技术提供足够的性能。
Summarizing the actuality of surface mount inductor, Introduces emphatically the manufacture technology and market of surface mount inductor.
概述了片式电感器现状，着重介绍了片式电感器制造技术与市场。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
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