Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
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