When to make quantitative analysis, thermal-stress is the first precondition, the temperature field can be conducted on the basis of the thermal stress solution.
定量分析热应力的首要前提是确定部件的温度场，在温度场的基础上才能进行热应力的求解。
Micrometeorites are a direct threat to humans and equipment, and solar-thermal stress is a significant problem for any structure in space.
微小陨石对人和设备也有直接的威胁，而在地外空间条件下，阳光辐射产生的热应力对于任何设备器材都将是严重的问题。
The interaction between casting and mold has a significant effect on the distribution of thermal stress during solidification.
铸件-铸型之间的相互作用对铸件凝固过程中热应力的分布有很大的影响。
The results of thermal stress analysis lay the solid foundation for design and improvement for gravity supports system for ITER .
热应力分析的结果为ITER重力支撑系统的设计或改进提供了可靠的理论依据。
This uneven hot and cold process, the workpiece will produce thermal stress.
这种不均匀冷热过程，会使工件中产生热应力。
And the distribution of thermal stress is one of the primary factors.
而其热应力分布问题是其中的主要因素。
"While we are not as fast as some quadrupeds, we are definitely well adapted to running for very long durations under extreme thermal stress, as marathon runners attest," Helton said.
“我们跑得没某些四足动物快，我们肯定适应在极端的温度下跑上非常长的时间，马拉松赛跑者证明了这一点”Helton说。
The thermal stress of RCC dam is different from concrete dams, and in order to get correct results, these different characteristics must be considered.
碾压混凝土坝的温度应力有它不同于常规混凝土坝的特点，必须考虑这些特点，才能得到正确的结论。
It was shown that the dynamic effect of the temperature and thermal stress of piston must be considered during thermal shock.
计算结果表明：活塞在热冲击期间表现的温度及热应力的动力学效应是必须加以考虑的。
According to the trial, we use finite element analysis program to conduct temperature field and thermal stress analysis of the pier under sunshine, and compared the outcome with experimental results.
根据试验采用有限元分析程序，进行日照作用下桥墩的温度场和温度应力分析，并与实验结果进行对比。
The ion-implantation damage defects and thermal stress during quenching step are responsible for the formation of dislocations.
位错的形成与离子注入引进的损伤和淬火过程中的热应力有关。
It tells the changing tendency of is contrary for work life of rolling stress and thermal stress roll rings under given assembly stress.
表明在一定的装配应力下，为保证辊环的使用寿命，轧制应力与热应力值的变化趋势相反。
The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。
The key of this technology is the formability and the control of the thermal stress. And these are associated with the temperature field and stress field.
熔积成形的技术关键是成形性与热应力的控制，而这些与成形过程的温度场和应力场紧密相关。
Rock failure induced by thermal stress is called thermal cracking. It is the result of thermal and mechanical coupling.
热应力引起的岩石破裂称为岩石的热破裂，它是热和力之间相互耦合作用的结果。
The equation on critical stress of matrix cracking that could consider the effect of interface layer and thermal stress can be obtained.
在此基础上建立了可以考虑界面层和热应力影响的基体开裂临界应力求解方程。
The temperature field and the thermal stress state of multilayer Wall pipe have a heavy effect on the reliability of structure.
多层圆管结构在不稳定导热过程中的温度场及其热应力状态，关系到结构的安全可靠性。
To investigate the influence of mechanical boundary conditions on the thermal stress, a comparison of the results between displacement boundary and stress boundary is made.
同时研究了数值分析中温度荷载作用下应力边界条件和位移边界条件对温度应力的影响。
Meanwhile, the fillet geometry has played an important role on this thermal stress distribution.
同时，钎缝圆角几何形状对这一热应力分布有重要影响。
This conclusion is some value to decrease thermal stress of cooling tubes and protect the sealing.
本文的结论对于减小冷却管热应力，防止凝汽器密封破坏，具有参考价值。
The results show that the damage of carbon fibers includes chemical damage, heat damage and physical damage of thermal stress.
研究结果表明，碳纤维的损伤包括了化学损伤、高温损伤和热应力物理损伤。
Under act of the alternating thermal stress, thermal fatigue is one of theprimary invalidity forms of cast iron workpiece.
在热交变应力的作用下，热疲劳是铸铁工件的主要失效形式之一。
The effect of plasticity deformation on residual thermal stress was investigated.
研究了塑性变形对残余热应力的影响；
The gradient coating can decrease the damage of the residual thermal stress.
梯度涂层在一定程度上可降低残余热应力对涂层的破坏。
The gradient distribution of coatings' composition can effectively reduce thermal stress during fabrication process.
涂层成分的梯度化，可有效地缓和制备过程中的热应力。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
Then, the temperature field is loaded in FEA software to predict thermal stress and deformation.
并以此温度场为边界条件，利用FEA软件计算了机体热应力和热变形。
Consider and prevent the product deformation caused by thermal stress release in the process of heat treatment.
预估及预防在热处理过程中因热压释放导致的产品变形。
Physicalmodels, thermal stress induced failure mechanisms and property studies are discussed.
探讨了增强模型、热应力损毁机理和性能测试。
The maximal thermal stress appears during the brake process.
最大热应力出现在制动过程中；
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