Multiphysics tools from ANSYS enable product designers to examine thermomechanical stresses in packages and boards that develop during thermal cycling.
ANSYS的多物理场工具模块能够帮助产品设计者检测热循环过程中在装置内部和基板之间的热压力。
Multiphysics tools from ANSYS enable product designers to examine thermomechanical stresses in packages and boards that develop during thermal cycling.
ANSYS的多物理场工具模块能够帮助产品设计者检测热循环过程中在装置内部和基板之间的热压力。
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