The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.
利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。
The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.
利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。
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