Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
应用推荐