This pa-per introduces thick film assembling technique, equipment, technical parameters and testing methods while narrating the manufacturing process of thick film circuits.
在叙述点火模块厚膜电路的生产过程中系统介绍了厚膜封装工艺、相关设备、技术参数和检测方法。
Thick film material and process applied in microwave and RF circuits are offered in the paper.
介绍了应用于微波和RF电路中的厚膜材料和工艺。
PRIMARY FUNCTION OF POSITION: Responsible for the product modification and localization of thick film materials, formula and process developing.
主要工作职责：负责厚膜浆料产品的产品研发，本地化，工艺改进，及浆料工艺方法改进。
PRIMARY FUNCTION OF POSITION: Responsible for the product modification and localization of thick film materials, formula and process developing.
主要工作职责：负责厚膜浆料产品的产品研发，本地化，工艺改进，及浆料工艺方法改进。
应用推荐