Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
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