The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.

探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。

youdao

The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.

探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。

youdao