• Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

    摘要晶片直接键合技术材料集成一项工艺是近年来集成光电子领域研究热点之一。

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  • Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.

    介绍三种典型圆片键合强度表现形式抗拉强度、剪切强度粘接强度。

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  • Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.

    本征氧化氧化层两键合界面退火过程中的行为进行了理论分析与比较。

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  • Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

    晶片直接键合技术材料集成一项工艺是近年来集成光电子领域研究热点之一。

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  • Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.

    介绍了晶圆键合工艺技术要求应用选择以及MEMS作用展示了MEMS制造技术应用前景

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  • The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.

    探讨使用湿化学硅片表面进行活化,完成硅圆片低温直接键合流程

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  • According to the present invention, defects of traditional wafer bonding process can be avoided.

    发明避免传统晶片粘合工艺缺点

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  • If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.

    芯片测试中,引线探针扎穿会影响引线合的牢固性器件可靠性

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  • Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.

    完成整体结构圆片级真空封装的同时,通过线腔结构方便地实现了中间电极的引线

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  • Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.

    完成整体结构圆片级真空封装同时通过线腔结构方便实现了中间电极的引线

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  • Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.

    静电键片状材料接的一种重要手段,讨论了玻璃电场作用下合过程。

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  • As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.

    作为半导体制造领域项新兴的使能技术晶圆直接键合已经在越来越多的领域发挥重要作用

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  • A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.

    穿孔金属载体用于晶片键合,用以容易处理以及松解。

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  • A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.

    穿孔金属载体用于晶片键合,用以容易处理以及松解。

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