The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.
本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。
The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging.
所述结构可具有较不复杂的聚焦、减小的串扰、较紧密的像素组装密度、提高的量子效率及晶 片级封装。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.
文章论述了超csptm圆片级封装技术工艺。
This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.
文章论述了超csptm圆片级封装技术工艺。
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